New Mirra Plus Amps Up 200mm CMP Systems

As a manager in a 200mm fab, you're looking for ways to get more out of your equipment. Mirra Plus brings the widely recognized benefits of Applied's market-leading 300mm CMP technology to 200mm. Mirra Plus increases yield, productivity and uptime. This extends copper/low k interconnect production on 200mm platforms to 65nm. Mirra Plus gives 200mm manufacturers a seamless and low risk path to higher CMP productivity and next-generation process control.

Mirra Plus is available from Applied Materials to your fab as a brand new or remanufactured system, in configurations for oxide and copper applications. Or, upgrade your existing 200mm CMP system with our Mirra Plus performance package to extend and enhance your fab at a fraction of the cost and time of replacing equipment.

The profitability of your 200mm production line depends on performance in 3 key areas:

• Technology
  Extend technology by improving wafer profile control, wafer to wafer repeatability and within-wafer non-uniformity.
  
  
• Productivity
  Enhance productivity by increasing removal rate (with less slurry usage), get higher throughput, and reduce preventive maintenance.
  
  
• Yield
  Increase yield with advanced process control, defect reduction and decreasing edge exclusion.

To learn more about Mirra Plus and the Plus performance package, go to My Applied Materials or ask your Applied Materials representative for more information.