Yield Enhancements

• 200mm Titan Contour Polishing Head
  Based on the production-proven 300mm Titan Contour polishing head, the 200mm Titan Contour polishing head has five independent pressure zones that produce unmatched within-wafer uniformity to 3mm edge exclusion (see figure 1).
  
  
• C3 Loadcup
  Reduce yield-killing defects associated with wafer front side contact. The C3 loadcup design features edge-only wafer contact and highly reliable, event-based wafer loading and unloading (see figure 2). Wafer loading/unloading speed is increased up to 50% and overall system throughput improvement of up to 10%.
  
  
• State-of-the-Art Advanced Process Control (APC)
  Achieve best in class wafer to wafer and within-wafer uniformity. The combination of Titan Contour polishing heads, on-board metrology and Applied Materials proprietary software enables automatic control of both polishing time and pressure within the zones of the polishing heads wafer to wafer and lot to lot (see figure 3).
  
  

Figure 1. Titan Contour’s five concentric pressure zones.	Figure 2. C3 loadcup’s edge-only wafer contact and event-based wafer loading/ unloading generate fewer defects.
Figure 3. WIW APC for ILD CMP for 80nm memory device wafers showed 80% Cpk improvement.

Go to My Applied Materials or ask your Applied Materials representative for more information.